Opening Remarks
Silicon photonics as a key growth opportunity for Singapore. Singapore's well established semiconductor ecosystem provides a strong foundation for silicon photonics, with existing foundries, cleanroom facilities, and advanced packaging capabilities.

13:40-14:00

Co-Packaged Optics as the Next-Generation Packaging Solution

The need for hyperconnectivity in large scale AI data centers is pushing the limits on size, power, and performance of optical components. In this talk we explore the challenges in designing increasingly complex, low power and high-speed optical interconnects for the Scale-Up, Scale-Out and Scale-Across applications.

Dr Radha Nagarajan, Chief Technology Officer, Marvell

14:00-14:20

Next Generation Ultra-High Performance Photonics IC’s for Amplification & Wide Transparency Waveguides

Steve Stoffels, CEO, Aluvia Photonics

14:20-14:40

Scaling AI and Cloud Interconnects With 300 MM Silicon Photonics and SiGe BiCMOS Innovation

This presentation explains how STMicroelectronics helps scale AI and cloud data centers using 300 mm silicon photonics and SiGe BiCMOS technologies.
As AI clusters and multi GW data centers grow, they need much faster, more efficient connections between GPUs and across sites.
Optical links, especially silicon photonics, are replacing copper and traditional optics for short reach, rack level, and multi site interconnects.
ST’s PIC100 silicon photonics platform provides high speed modulators and photodiodes with low loss waveguides and efficient fiber coupling, enabling 200–400 Gb/s per lane and future optical I/O / co packaged optics. The B55X BiCMOS platform supplies high performance TIAs and laser drivers based on advanced SiGe technology.
By combining PIC100 and B55X on 300 mm wafers, and using 3D stacking, TSVs, and advanced packaging, ST supports wafer scale electro optic integration for next generation optical engines. With its global IDM manufacturing footprint, ST offers performance, scalability, and supply chain robustness for AI and cloud interconnects.

Koh Kwang Meng, Technical Marketing Manager, STMicroelectronics

14:40-15:00

Unlocking the Power of Light: Scaling User-Centric Photonics Innovation with Precision

Photonics is transforming how we compute, sense, and communicate. Bringing breakthrough ideas from the lab to global markets remains a major challenge for startups. In this session, NicsLab shares its journey as a performance-driven deep-tech company building high-precision control and measurement systems for optical communication, quantum research, audio-visual technologies, and advanced sensing.
The session will explore how emerging photonics companies can accelerate prototyping, design for reliability and scale, secure early adopters, and leverage cross-border partnerships to enter global supply chains. Attendees will gain insights into how startups can compete through precision engineering, agility, and user-centric innovation, shaping the next wave of photonics applications worldwide.

Andri Mahendra, Founder, Nicslab

15:00-15:20

Unlocking the Next Generation of PICs and Co-Packaged Optics with Multiphysics EDA

This session will demonstrate how multiphysics simulation enables engineers to accurately predict and manage the complex interactions between electrical, optical, and thermal phenomena within Photonic Integrated Circuits (PICs) and sophisticated advanced semiconductor packages.

Desmond Tan, Principal Application Engineer, Ansys (part of Synopsys)

15:20-16:00

Building the Silicon Photonics Supply Chain of the Future: Perspectives from Singapore and Global Partners

With photonics moving from research labs into real-world applications, the creation of a resilient and scalable global supply chain is becoming ever critical. Singapore’s position as a leading semiconductor and advanced manufacturing hub makes it an ideal partner for cross-border collaboration on Silicon Photonics. This panel explores how Singapore’s industry players — including Moveon Technologies — are partnering with leading ecosystems from the Netherlands and Taiwan to accelerate the transition from prototype to production. The discussion will examine supply chain gaps, opportunities for co-development, and the role of international collaboration in bringing photonics solutions to market at scale.

Moderator: Dr. Karen Chong, Managing Director, Asia Venture Partners
Alex Wu, Vice President, Heterogeneously Integrated Silicon Photonics Alliance (HiSPA)
Pim Veldhuizen, Head of Process Innovation, Morphotonics
Chee Teck Lee, CEO and Co-Founder, Moveon Technologies
Rene Jonker, Executive Vice President and Chief Product Officer, Soitec

16:00-17:00

Networking

17:00

End of Conference