Advanced Semiconductor Manufacturing Forum
5 February 2026 10:30 - 12:35
Technical Theatre
Organisers
Asia Photonics Expo (APE)
Centre of Advanced Power and Autonomous Systems (APAS)
Hong Kong Productivity Council (HKPC)
Background
As a cornerstone of the information technology industry, the semiconductor industry is driving the next wave of technological breakthroughs and industrial transformation. The World Semiconductor Trade Statistics (WSTS) predicts that the global semiconductor market size will reach USD 700.9 billion in 2025, with a year-on-year growth of 11.2%. Looking ahead to 2026, the global semiconductor market size is expected to rise by 8.5% to USD 760.7 billion.
With the surge of AI large models, new energy vehicles and 6G technology, the global demand for high-performance and high-power density semiconductors has accelerated. To break through physical limits and cost bottlenecks, the industry is transforming towards “system integration + material innovation”, making progress in the three major fields of materials, equipment and processes. Chiplet packaging, third-generation semiconductors and high-end testing equipment have become core directions.
Looking ahead, the semiconductor industry will move away from single-point technology competition and shift towards full-chain collaborative innovation in materials, equipment and processes, building a more resilient industrial ecosystem in response to geopolitical challenges.
The “Advanced Semiconductor Manufacturing Forum” will gather leading enterprises and experts from the semiconductor industry to share insights into market trends and technological advancements. The forum will delve into key topics such as cutting-edge semiconductor materials, equipment, and process technologies – inspiring collaboration and strengthening the foundation for a more resilient and future-ready semiconductor industry.
Agenda
| Advanced Semiconductor Manufacturing Forum | |||
| Time | Topics | Speakers | |
| Host: Joel K. W. Yang, Cheng Tsang Man Chair Professor. Optica Fellow, Director (Cleanroom) Associate Head of Pillar (EPD) (Research and Advancement) Singapore University of Technology and Design (SUTD) |
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10:30-10:35 |
Opening and Welcome Speech |
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10:35-10:55 |
Enabling Functional Diversity with Heterogeneous Integration |
Chuan Seng Tan |
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10:55-11:15 |
From Meta-Atoms to Mass Production: Scaling Metalens and Metasurface Optics for Imaging, Sensing and Semiconductor Manufacturing | Dr. Tobias W. W. Mass |
|
11:15-11:35 |
Designing High-performance Co-Packaged Optics (CPO) with Photonic and Multiphysics Simulation |
Albert Wong |
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11:35-11:55 |
2.5D / 3D EDA+ New Paradigm - Advanced Packaging: Architecting & Physical Implementation, Simulation, and Testing |
Dr. Alex Zhao |
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11:55-12:15 |
Advanced FET and Photonic Technology Modeling Spanning Atomic Physics to IC Realization |
Satish S |
|
12:15-12:35 |
Semiconductor Technological Innovation: Enabling the Future Vision of Smart Mobility and High-End Manufacturing |
Dr. Rick MO |
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Host
Joel K. W. Yang
Cheng Tsang Man Chair Professor
Optica Fellow, Director (Cleanroom)
Associate Head of Pillar (EPD) (Research and Advancement)
Singapore University of Technology and Design (SUTD)
Featured Speakers
Chuan Seng Tan
Professor - Nanyang Technological University, Singapore.
Co-Director - National Centre for Advanced Integrated Photonics (NCAIP).
Tobias W. W. Mass
Vice President Systems - Metaoptics Technologies Pte Ltd.
Albert Wong
Technical Manager - Cybernet Systems Malaysia / Airboard Technology.
Dr. Alex Zhao
Founder & CEO - Zhuhai Silicon Chip Technology Ltd.
Satish S
Technical Manager - CADFEM SEA Pte Ltd.
Dr. Rick MO
Head - Business Development and Commercialisation,
Head - Emerging Applications,
Centre of Advanced Power and Autonomous Systems (APAS), Hong Kong Productivity Council (HKPC).
Sponspors
Conference Contact
For any inquiries about this conference, please contact:
Cafiar Dai
E-mail:Cafiar.Dai@informa.com