Advanced Semiconductor Manufacturing Forum

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Advanced Semiconductor Manufacturing Forum

5 February 2026 10:30 - 12:35

Technical Theatre

Organisers

Asia Photonics Expo (APE)
Centre of Advanced Power and Autonomous Systems (APAS)
Hong Kong Productivity Council (HKPC)

Background

As a cornerstone of the information technology industry, the semiconductor industry is driving the next wave of technological breakthroughs and industrial transformation. The World Semiconductor Trade Statistics (WSTS) predicts that the global semiconductor market size will reach USD 700.9 billion in 2025, with a year-on-year growth of 11.2%. Looking ahead to 2026, the global semiconductor market size is expected to rise by 8.5% to USD 760.7 billion.

With the surge of AI large models, new energy vehicles and 6G technology, the global demand for high-performance and high-power density semiconductors has accelerated. To break through physical limits and cost bottlenecks, the industry is transforming towards “system integration + material innovation”, making progress in the three major fields of materials, equipment and processes. Chiplet packaging, third-generation semiconductors and high-end testing equipment have become core directions.

Looking ahead, the semiconductor industry will move away from single-point technology competition and shift towards full-chain collaborative innovation in materials, equipment and processes, building a more resilient industrial ecosystem in response to geopolitical challenges.

The “Advanced Semiconductor Manufacturing Forum” will gather leading enterprises and experts from the semiconductor industry to share insights into market trends and technological advancements. The forum will delve into key topics such as cutting-edge semiconductor materials, equipment, and process technologies – inspiring collaboration and strengthening the foundation for a more resilient and future-ready semiconductor industry.

Agenda

Advanced Semiconductor Manufacturing Forum
Time Topics Speakers
Host: Joel K. W. Yang, Cheng Tsang Man Chair Professor.
Optica Fellow, Director (Cleanroom)
Associate Head of Pillar (EPD) (Research and Advancement)
Singapore University of Technology and Design (SUTD)

10:30-10:35

Opening and Welcome Speech

10:35-10:55

Enabling Functional Diversity with Heterogeneous Integration

Chuan Seng Tan
Professor, Nanyang Technological University, Singapore.
Co-Director, National Centre for Advanced Integrated Photonics (NCAIP).

10:55-11:15

From Meta-Atoms to Mass Production: Scaling Metalens and Metasurface Optics for Imaging, Sensing and Semiconductor Manufacturing

Dr. Tobias W. W. Mass
Vice President Systems, Metaoptics Technologies Pte Ltd.

11:15-11:35

Designing High-performance Co-Packaged Optics (CPO) with Photonic and Multiphysics Simulation

Albert Wong
Technical Manager, Cybernet Systems Malaysia / Airboard Technology.

11:35-11:55

2.5D / 3D EDA+ New Paradigm - Advanced Packaging: Architecting & Physical Implementation, Simulation, and Testing

Dr. Alex Zhao
Founder and CEO, Zhuhai Silicon Chip Technology Ltd.

11:55-12:15

Advanced FET and Photonic Technology Modeling Spanning Atomic Physics to IC Realization

Satish S
Technical Manager, CADFEM SEA Pte Ltd.

12:15-12:35

Semiconductor Technological Innovation: Enabling the Future Vision of Smart Mobility and High-End Manufacturing

Dr. Rick MO
Head, Business Development and Commercialisation,
Head, Emerging Applications,
Centre of Advanced Power and Autonomous Systems (APAS), Hong Kong Productivity Council (HKPC).

 

Host

Joel K. W. Yang

Cheng Tsang Man Chair Professor
Optica Fellow, Director (Cleanroom)
Associate Head of Pillar (EPD) (Research and Advancement)
Singapore University of Technology and Design (SUTD)

Featured Speakers

Chuan Seng Tan

Professor - Nanyang Technological University, Singapore.
Co-Director - National Centre for Advanced Integrated Photonics (NCAIP).

Tobias W. W. Mass

Vice President Systems - Metaoptics Technologies Pte Ltd.

Albert Wong

Technical Manager - Cybernet Systems Malaysia / Airboard Technology.

Dr. Alex Zhao

Founder & CEO - Zhuhai Silicon Chip Technology Ltd.

Satish S

Technical Manager - CADFEM SEA Pte Ltd.

Dr. Rick MO

Head - Business Development and Commercialisation,
Head - Emerging Applications,
Centre of Advanced Power and Autonomous Systems (APAS), Hong Kong Productivity Council (HKPC).

Sponspors

硅芯科技
友臻1

Conference Contact

For any inquiries about this conference, please contact:

Cafiar Dai
E-mail:Cafiar.Dai@informa.com