TrendForce data shows that the combined capex of Google, AWS, Meta, Microsoft, Oracle, Tencent, Alibaba, and Baidu grew from US$145.1 billion in 2021 to US$260.9 billion in 2024, a CAGR of 21.6% over the period.
Surging demand for AI GPUs, custom ASICs, server CPUs and high-speed networking chips is propelling the global ABF packaging substrate industry into a new phase of structural expansion.
SECON & eGISEC 2026 attracted 412 exhibitors from 19 countries and regions and 26,389 industry professionals from over 31 countries and regions. The event featured 32 conference tracks, over 159 sessions, more than 410 business-matching meetings, and over 170 international hosted buyers
In APE’s Photonics Spotlight series, Dr. Luo Xianshu shares his insights on how silicon photonics and co-packaged optics (CPO) are addressing AI interconnect bottlenecks, the ecosystem challenges for photonics heterogeneous integration (PHI), and the roadmap for emerging applications such as LiDAR, biosensing, and quantum computing. He also discusses NSTIC (Advanced Photonics) role in accelerating innovation and his outlook for Asia Photonics Expo 2026 as a catalyst for industry research collaboration.