Opening Remarks

13:40-14:00

Co-Packaged Optics as the Next-Generation Packaging Solution

The need for hyperconnectivity in large scale AI data centers is pushing the limits on size, power, and performance of optical components. In this talk we explore the challenges in designing increasingly complex, low power and high-speed optical interconnects for the Scale-Up, Scale-Out and Scale-Across applications.

Dr Radha Nagarajan, Chief Technology Officer, Marvell

14:00-14:20

Innovations in the Semiconductor to Meet AI Demand

The convergence of photonics and electronics is pushing the semiconductor industry to adopt new production methods for integrated photonic devices.

14:20-14:40

PIC Applications

Advancing efficient data transfers in optical modules with silicon photonics

STMicroelectronics

14:40-15:00

Unlocking the Power of Light: Scaling User-Centric Photonics Innovation with Precision

Photonics is transforming how we compute, sense, and communicate. Bringing breakthrough ideas from the lab to global markets remains a major challenge for startups. In this session, NicsLab shares its journey as a performance-driven deep-tech company building high-precision control and measurement systems for optical communication, quantum research, audio-visual technologies, and advanced sensing. The session will explore how emerging photonics companies can accelerate prototyping, design for reliability and scale, secure early adopters, and leverage cross-border partnerships to enter global supply chains. Attendees will gain insights into how startups can compete through precision engineering, agility, and user-centric innovation, shaping the next wave of photonics applications worldwide.

Andri Mahendra, Founder, Nicslab

15:00-15:20

Unlocking the Next Generation of PICs and Co-Packaged Optics with Multiphysics EDA

This session will demonstrate how multiphysics simulation enables engineers to accurately predict and manage the complex interactions between electrical, optical, and thermal phenomena within Photonic Integrated Circuits (PICs) and sophisticated advanced semiconductor packages.

Desmond Tan, Principal Application Engineer, Ansys (part of Synopsys)

15:20-16:00

Building the Silicon Photonics Supply Chain of the Future: Perspectives from Singapore and Global Partners

With photonics moving from research labs into real-world applications, the creation of a resilient and scalable global supply chain is becoming ever critical. Singapore’s position as a leading semiconductor and advanced manufacturing hub makes it an ideal partner for cross-border collaboration on Silicon Photonics. This panel explores how Singapore’s industry players — including Moveon Technologies — are partnering with leading ecosystems from the Netherlands and Taiwan to accelerate the transition from prototype to production. The discussion will examine supply chain gaps, opportunities for co-development, and the role of international collaboration in bringing photonics solutions to market at scale.

Chee Teck Lee, CEO and Co-Founder, Moveon Technologies
Alex Wu, Vice President, Heterogeneously Integrated Silicon Photonics Alliance (HiSPA)

16:00-17:00

Networking

17:00

End of Conference